miniature rf blocking network 24 for rf noise suppression in high speed mixed signal semiconductor devices j 30 xx ba01 2 l x 4 part number identification product j = blocking network width (mils) material bl or bj internal drawing reference voltage 2 = 25 vdc metallization 100? gold finish test level commercial number of rc segments material and electrical characteristics material capacitance resistance rated code (typical) (pad to pad) df tcc voltage bl 30 pf 10 nom. 3.0% max. x7r 25 vdc bj 45 pf 10 nom. 3.0% max. x7r 25 vdc functional applications: ? high speed digital ? mixed signal ics ? suppression of noise on ? dc supply lines ? mcm and hybrid modules bene(ts: ? eliminates noise at i/o pins ? replaces large decoupling capacitor ? with superior performance ? clean dc lines beyond 18 ghz layout and dimensions segment equivalent schematic representation
miniature rf blocking network 25 metallization: top: 50?/square tan, 300? tiw, 100 ? inch minimum au. bottom: 300? tiw, 100 ? inch minimum au. screening options test code test/inspection sample size description bond strength 2 pcs/plate 2 bonding pads on each sample x ir 1% aql 2 1 / 2 times rated voltage of 25 volts visual inspection 100% 4 si de vi sual s cre e nin g pad to pad resistance check 1% aql ensure isolation between segments and boarder performance segment bonding for measurement for additional data of multi-segment devices please contact an inside sales representative. typical application
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